Electronics Industry

I. Solution Background and Objectives

The electronic industry has extremely high requirements for material precision, reliability, and functionality, covering core links such as semiconductor manufacturing, electronic component packaging, and lithium battery production. Based on the needs of the electronic industry for antistatic, insulation, flame retardancy, and weather resistance, Mingskye Plastic relies on its polymer material technology advantages to provide a full – process material solution to enhance the performance stability of electronic equipment, ensure production safety, and help the electronic industry develop towards high precision and high reliability.

II. Core Application Scenarios and Product Solutions in the Electronic Industry

(A) Semiconductor Manufacturing Field

PP Antistatic Material Solution
- Application Scenarios: Wafer trays in semiconductor chip production, gaskets for electronic components, electromagnetic shielding covers, and surface protection for precision instruments.
- Product Selection:
  - KJD Series Antistatic Sheets: Such as KJD – 015 (thickness 0.15mm, specific gravity 0.93, surface resistance 10⁸ – 10¹⁰Ω), with double matte/double rough texture and white / 本色 colors.
  - Antistatic Frames and Gaskets: Customized according to equipment dimensions to ensure compatibility with semiconductor production lines.
- Technical Advantages:
  - The surface resistance is stably maintained at 10⁸ – 10¹⁰Ω, effectively preventing static electricity from damaging chips.
  - It does not contain harmful substances such as sulfur, chlorine, and bromine, avoiding oxidation pollution to semiconductor components.
  - The antistatic performance is not affected by humidity and temperature, adapting to the constant temperature and humidity environment of the semiconductor workshop.
- Testing and Certification: It has passed RoHS, Reach, and negative ion pollution tests, and relevant test reports can be provided.
PC Flame – Retardant Material Solution
- Application Scenarios: Insulation partitions, switch panels, and fireproof labels of semiconductor equipment.
- Product Selection:
  - XCPC Series PC Sheets: Such as XCPC – 0250 (thickness 0.25mm, specific gravity 1.2, light transmittance >89%), with flame – retardant grades meeting the fireproof requirements of electronic equipment.
- Technical Advantages:
  - The flame – retardant performance meets the UL94 standard, and it extinguishes immediately after leaving the fire, reducing the fire risk of equipment.
  - High insulation resistance (surface resistance 10¹¹Ω) to avoid circuit short – circuit.
  - Resistance to high and low temperature shocks, adapting to the temperature fluctuation environment in semiconductor manufacturing.

(B) Lithium Battery Production Field

Lithium Battery PP Wrapping Film and Separator Solution
- Application Scenarios: Cell wrapping, positive and negative separators, and bare cell trays of new energy lithium batteries.
- Product Selection:
  - LDM Series Wrapping Films: Such as LDM – 010 (thickness 0.10mm, specific gravity 0.91, gram weight 91g), with matte/mirror surface and Ra value 0.2 – 1.2.
  - PP Thick Plate Reinforcement Plates: Such as LDM – 050 (thickness 0.5mm, specific gravity 0.91, gram weight 455g), used for reinforcing the positive and negative structures.
- Technical Advantages:
  - Resistance to acid and alkali and corrosion by electrolyte, ensuring the long – term stable operation of lithium batteries.
  - High compressive strength and insulation resistance to prevent cell short – circuit.
  - Passed tests such as puncture strength and electrical strength, complying with lithium battery safety standards.
Polymer Bonding Film Solution
- Application Scenarios: Composite bonding of metal and plastic parts inside lithium batteries (such as fixing electrodes and diaphragms).
- Product Selection:
  - XCPP – 3430 Bonding Film: Thickness 0.05 – 0.8mm, width can be customized, using imported polymer modified materials.
- Technical Advantages:
  - Strong adhesive force, which can firmly bond metals (such as aluminum foil) and PP diaphragms.
  - Resistance to boiling water and temperature difference shocks, adapting to the temperature changes during the charging and discharging of lithium batteries.
  - Non – toxic and no solvent volatilization, meeting the environmental protection requirements of lithium batteries.

(C) Electronic Component Packaging and Protection Field

BOPP Transparent Film Solution
- Application Scenarios: Packaging films for electronic components, label base films, and composite protective films.
- Product Selection:
  - XBP Series BOPP Films: Such as XBP – 030 (thickness 30μm, specific gravity 0.91, gram weight 23g), with optional glossy/matte surfaces.
- Technical Advantages:
  - High transparency (light transmittance >90%), facilitating the appearance inspection of components.
  - High tensile strength and impact resistance, protecting components from damage during transportation.
  - Good printing adaptability, enabling the customization of anti – counterfeiting labels or parameter identification.
PP Flame – Retardant Material Solution
- Application Scenarios: Housings of electronic components, terminal blocks, and power supply shielding covers.
- Product Selection:
  - ZRM Series Flame – Retardant Sheets: Such as ZRM – 038 (thickness 0.38mm, specific gravity 0.93, flame – retardant grade UL94 V – 0), in black/white colors.
- Technical Advantages:
  - Halogen – free flame retardancy, low smoke and environmental protection, in line with the green production requirements of the electronic industry.
  - Good thermal stability, maintaining structural stability in high – temperature environments.
  - Easy to process and form, supporting the customized production of complex component housings.

(D) Electronic Equipment Manufacturing and Assembly Field

PP Synthetic Paper/Whiteboard Solution
- Application Scenarios: Circuit board partitions, liquid crystal display backplanes, and nameplate labels.
- Product Selection:
  - HCZ Series Synthetic Paper: Such as HCZ – 150 (thickness 0.15mm, specific gravity 0.93 – 1.28, whiteness value 96 + 3), with fine matte / texture.
- Technical Advantages:
  - Good stiffness and toughness, avoiding deformation of circuit boards during transportation.
  - Waterproof and moisture – proof, adapting to the humid environment of electronic equipment assembly workshops.
  - Excellent insulation performance, preventing circuit board short – circuit.
55 – layer Nano Stretch Film Solution
- Application Scenarios: Packaging winding, pallet fixing, and dust protection for finished electronic equipment.
- Product Selection:
  - Machine – used Stretch Film: Such as the Genius (D) model (thickness 15μm, ultimate stretch rate 400%), suitable for automated packaging lines.
- Technical Advantages:
  - 55 – layer nano – structure design, high elasticity and puncture resistance, reducing packaging damage.
  - Stable performance at low temperatures (-20℃), adapting to cold chain transportation needs.
  - It can reduce the use of packaging materials by 50%, lowering the packaging cost of electronic equipment.

III. Solution Implementation and Technical Support System

(A) Customized Development Services

Parameter Customization: Adjust material thickness (such as antistatic sheets 0.1 – 1.0mm), surface resistance (10⁸ – 10¹⁰Ω), flame – retardant grade (UL94 V – 0/VTM – 0) and other parameters according to the specific needs of the electronic industry.
Process Adaptation: For precision processes such as semiconductor lithography and lithium battery winding, provide surface treatment (such as matte, mirror) and size customization (tolerance ±0.01mm).

(B) Testing and Certification Support

Laboratory Capabilities: A self – built material testing laboratory can carry out tests such as RoHS, Reach, halogen, insulation resistance, and high and low temperature shock.
Qualification Documents: Provide IATF16949 certification, national high – tech enterprise certificate, and material test reports to meet the compliance requirements of electronic industry customers.

(C) Supply Chain Guarantee

Production Capacity Support: With 5 PP film casting lines and 3 thick plate lines, the annual production capacity is 15,000 tons, supporting the stable bulk supply of large customers in the electronic industry.
Logistics Services: Provide dust – free packaging and antistatic transportation solutions to ensure that materials are not polluted or damaged by static electricity during delivery.

IV. Core Customers and Application Cases

Mingskye Plastic has provided material solutions for leading enterprises in the electronics and new energy fields such as Huawei, BYD, CATL, AVIC Lithium Battery, and Gotion High – Tech. Its products are applied in scenarios such as 5G base station electronic components, new energy vehicle battery packs, and semiconductor packaging equipment, and the reliability and stability of the materials have been verified through long – term cooperation.

V. Summary of Solution Advantages

Full – scene Coverage: From semiconductor manufacturing to lithium battery packaging, it provides all – category materials such as antistatic, flame – retardant, and insulation, adapting to the full – process needs of the electronic industry.
Technical Leadership: Supported by a technical team with more than 20 years of industry experience and holding multiple patents, the material performance meets international standards such as UL94 and RoHS.
Quality Control: Dust – free workshop production + full – process inspection to ensure material consistency and meet the electronic industry’s requirements for ppm – level defect rates.

By integrating polymer material technology and the needs of the electronic industry, Mingskye Plastic’s solution is committed to providing customers with material products that combine performance, cost, and reliability, and promoting the development of the electronic industry towards high precision and high safety.